Dow Electronic Materials
Organic Gap Filling Material - AR™ 201
Product Category: Below Resists: Gap Filling Material
AR™ 201 is an organic gap filling material. It can fill extremely narrow trench without voids and provides an excellent solution for advanced devices with FinFET structures. AR™ 201 can also work as an anti-reflectant and reduce reflectivity for KrF and ArF processes.
Features
- Optimal n&k values for hyper NA exposure
- High etch rate
- Good compatibility with resist
- Excellent coating property
- Good EBR/RRC solvent compatibility
Benefits
- Improves critical dimension uniformity (CDU)
- Improves lithographic process margins
- Improves etch process margins
Conventional SOC
AR™ 201