Dow Electronic Materials

Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

A market outlook: Will OLEDs Prevail in 2018 Display Markets?

March 15, 2018

The display market is exciting with innovative technology on the horizon like flexible OLED displays. The display market is in a period of transition, with LCD displays unstable, QDs a bit unknown and OLEDs seemingly in the driver’s seat. Dow’s Hwang shares his thoughts on this exciting market.

2018 Semiconductor Industry Outlook: Riding a Growth Trend

March 13, 2018

A businessman sits in a chair contemplating the semiconductor industry outlook. Dow’s Adam Manzonie gives his insight on what may extend the semiconductor industry’s growth in 2018. Overall product quality from material suppliers is key in 2018 to meet ever more stringent process control requirements.

Dow Litho and CMP Experts to Present Research at SEMICON China’s CSTIC

March 09, 2018

A view of the Shanghai International Convention Center, host of CSTIC 2018 During the China Semiconductor Technology International Conference (CSTIC), representatives from Dow will share research on two topics: patterning materials for advanced 193nm immersion lithography, and the relationship between pad and slurry in CMP process optimization.

3D InCites: It’s Time to Get Serious About (Advanced Packaging for) 5G

March 08, 2018

Advanced packaging as the key to 5G Dow’s Rob Kavanagh discusses how advanced packaging will be a key asset for the development of 5G and the connectivity of all IoT devices. With the strict design and materials requirements for 5G, this proposes some challenges as well as opportunity for the semiconductor industry.

IMAPS DPC 2018 to Explore the Future of Advanced Packaging

February 26, 2018

The future of advanced packaging IMAPS Device Packaging Conference is always at the forefront of semiconductor advanced packaging, and this year, it will look into the future. Check out Dow presentations from Dow experts during this year’s event.

Dow’s Peter Trefonas Named SPIE Fellow

February 26, 2018

TrefonasThumbnail Dow’s Peter Trefonas has been named a Fellow of SPIE, the international society for optics and photonics. Trefonas has been recognized for his achievements in design for manufacturing and compact modeling.

SPN Viewpoint 2018: The Fan-Out Conversation and Memory Growth Continue

February 15, 2018

Teardown of a modern mobile device highlights a number of relevant 2018 advanced packaging trends. In this look ahead to 2018, Rob Kavanagh discusses advanced packaging trends for 2018. With the memory market is on the rise, advanced packaging suppliers will be faced with more challenges.

Dow Prepares for the 2018 SPIE Advanced Lithography Conference

January 29, 2018

The SPIE Advanced Lithography conference is known for leading-edge technical research. In 2018, Dow will present on: improving performance through LWR analysis; the trade-offs of shot noise, LER and RLS; and innovative SiARC materials for implant lithography.

Boric Acid-Free Nickel Electroplating: Another REACH Challenge

January 22, 2018

EU REACH continues to identify and act potentially harmful substances; boric acid and borate salts may face increased restriction. Dow is developing boric acid replacement electrolytes for nickel, with boric acid-free nickel plating already demonstrated.

Dow and DuPont Previewed Future Display Technologies at IMID 2017

December 11, 2017

The possibilities for future display technologies are seemingly endless, from OLED to flexible to quantum dot. Together Dow and DuPont recently showcased how they are advancing high performance displays with the latest materials innovations.