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Connectivity

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Showing all articles related to Cu pillars Pb-free plating

Copper Pillar Electroplating Tutorial

December 08, 2016

This tutorial examines the requirements and processing considerations for electroplated copper pillars used in advanced chip packaging applications. The key aspects of the plating process and the role of each in achieving the desired design and performance goals are described.

Dow to Present at PRiME 2016: From TSV to Copper Pillars’ Transformative Technology

September 27, 2016

The Pacific Rim Meeting on Electrochemical and Solid-State Science (PRiME) conference brings together leading industry players to discuss a diverse blend of electrochemical and solid-state science and technology. This year, Dow Electronic Materials will present on how TSV and copper pillars are transforming semiconductor advanced packaging technology.

Does Electrodeposited Indium have a Future in Advanced Packaging?

May 04, 2016

Low temperature bonding using electrodeposited indium

Copper (Cu) pillars are important interconnect structures used in advanced IC packaging, requiring cost-effective solder capping materials, and lower bonding temperature is emerging as an important driver. This article provides an overview of “Enabling Low-Temperature Bonding in Advanced Packaging using Electrodeposited Indium,” to be presented at the 2016 ECTC sponsored by IEEE.

Wafer Bumping Considerations: The importance of the interface between metal layers

March 15, 2016

Capped pillar – intermetallic compound compatibility, metal layer interface

Many new assembly processes are in development, including ultra thinning of wafers to enable stacked die, package-on-package (PoP) and ultra-thin packages. Wafer-level packaging (WLP) to improve reliability and I/O count, ball pitch and routability are also imperative. This post provides an introduction on materials considerations for the interface between metal layers in wafer bump structures.

Lead-free Materials Are Critical to Sustainable Manufacturing

February 15, 2016

Dow Electronic Materials has been actively developing a line of lead-free advanced packaging materials that help manufacturers comply with RoHS and REACH, while ensuring a level of reliability equivalent to lead-based materials. This article introduces "Lead-free solder electroplating products for advanced bumping technologies," first presented at IMAPS Device Packaging Conference.