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Showing all articles related to Printed circuit board (PCB)

MICROFILL™ SFP Acid Copper Earns Dow its Ninth NPI Award in 10 Years

April 09, 2018

Photo of Dow’s 9th PCD&F Award honoring Microfill SFP Acid Copper.Industry awards are one of the strongest endorsements of a company’s products, especially when judged by peers. Dow is honored to receive it’s ninth PCD&F NPI Award this year for MICROFILL™ SFP Acid Copper.

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Tailoring Copper Plating for Vias on IC Package Substrates

November 28, 2017

IC substrate manufacturers must innovate to be competitive in a landscape where feature dimensions continue to shrink. Copper plating chemistries optimized for IC substrates is one step manufacturers can take toward achieving their production goals.

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Dow and DuPont to Exhibit at Productronica

November 02, 2017

With the merger of Dow and DuPont freshly completed, this year’s Productronica show, taking place Nov. 14-17 in Munich, Germany, represents the first opportunity to meet with the companies post-merger. So, what will change moving forward?

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How Silver Catalysts Enhance PCB Manufacturing

October 31, 2017

Used in many applications, silver catalysts provide a balance of features: good catalytic activity, high electrical conductivity, modest cost, and good process stability. As such, they are increasingly being explored for use in PCB manufacturing.

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Flexible PCBs for Smartphones Need New Metallization Processes

September 26, 2017

Consumers are demanding ever-more functionality and battery life from their smartphones, which is driving a need for flexible PCBs (FPCBs). This article looks at design considerations of metallization processes for FPCBs, which will enable future devices.

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Advanced Via Fill for HDI Applications

August 01, 2017

The smart phone market is driving improved via fill for HDI substrates, but it will also be needed for several emerging electronics markets. Continuous innovation in copper via fill is needed to meet new requirements.

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Inkjet Masking Reduces Gold Usage (and Cost) in Connectors

July 19, 2017

 

In the electrical connector industry, gold is frequently used because of its conductivity. Given its cost, there is a strong manufacturing need for a more effective masking procedure that can be carried out rapidly and offers improved resolution in reel-to-reel production.

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Cleaning Up PCB Final Finish: Cyanide-Free ENIG Coatings

May 04, 2017

Although there are many potential roadblocks to cleaning up PCB final finishes, reliable cyanide-free ENIG surfaces now deliver low gold porosity and excellent corrosion resistance.

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NPI Awards Honor COPPER GLEAM™ PPR-II Acid Cu Plating

March 22, 2017

The annual NPI Awards recognize best-of-breed new products. We're proud to announce that Dow’s COPPER GLEAM™ PPR-II Acid Cu was named best new plating technology for 2017.

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Advancing the Thick PCB Manufacturing Process for 5G Infrastructure

March 20, 2017

The demand for thick PCBs is increasing, presenting a challenge and an opportunity for copper plating. Here, we look at how Dow is advancing the thick PCB manufacturing process to support the growth of 5G infrastructure.

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