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Showing all articles related to Lithography for semiconductor manufacturing

2017 Outlook: Lithography Materials Support Growth in China

January 31, 2017

Shuji Ding-Lee discusses the role lithography materials play in enabling next-gen technologies, as well as the growth of China’s IC market and requirements for materials suppliers.

Transitioning to Chromium-Free Etch Technology for Plating on Plastics

January 24, 2017

Dow reports on its progress towards a plating on plastics (POP) process free from hexavalent chromium to comply with REACH legislation.

2017 Outlook: Fan-out Wafer Level Packaging Goes Mainstream

January 13, 2017

Dow’s Rob Kavanagh joins other Dow leaders voicing their opinions on what’s coming in the semiconductor industry in the new year. In his 2017 outlook for Semiconductor Packaging News, Kavanagh looks at what’s needed to meet the challenges of fan-out water level packaging.

Technology Spotlight: CTO™ 2000 Trimming Overcoat Named an R&D; 100 Finalist

October 27, 2016

The R&D 100 Awards are one of the highest honors in the research and design community. In this interview, we talk to Dow experts about the innovation behind one of this year’s finalists, CTO™ 2000 Trimming Overcoat, a solution for lithography in semiconductor manufacturing that enables patterning of smaller features than photolithography can do alone.

Peter Trefonas, 2016 Perkin Medal Recipient, Credits Chemistry for Enabling the Information Age

September 26, 2016

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Peter Trefonas, Ph.D., received the Society of Chemical Industry (SCI) Perkin Medal on September 13, 2016, recognized as the highest honor given for outstanding work in applied chemistry in the United States. At the award ceremony, Trefonas spoke to how chemistry innovations enabled the Information Age.

Dow’s Peter Trefonas, Ph.D., Interviewed at SPIE Advanced Lithography

September 06, 2016

At the 2016 SPIE Advanced Lithography Conference, Peter Trefonas, Ph.D., was interviewed about his experiences in the field of photolithography. Throughout Trefonas’ 30+ years in the lithography field he has made significant contributions to photoresist technology and anti-reflective coatings.

Semiconductor Manufacturing Technologies from Dow Named Finalists for R&D; 100 Awards

August 31, 2016

Two Dow technologies used in the process of fabricating integrated circuits have been named finalists in R&D Magazine’s prestigious 2016 R&D 100 Awards. Our CTO™ 2000 Trimming Overcoat enhances the photolithography process while IKONIC™ 4100 Polishing Pads optimize performance for chemical mechanical planarization (CMP).

Chemical Trimming Overcoat Enhances Multiple Pattern Lithography

July 29, 2016

Extreme ultraviolet (EUV) technology is solidly positioned on the semiconductor manufacturing roadmap, but interim technologies are needed to extend 193nm immersion lithography until EUV enters production. Multiple patterning is one such technology, and this article discusses a novel spin-on chemical trim overcoat formulation that simplifies the advanced patterning process.

The State of EUV Lithography: A Materials Primer

July 19, 2016

Extreme ultraviolet (EUV) lithography is the most promising of the post-optical lithography patterning technologies to enable continued shrink, keeping the semiconductor industry on the path of Moore’s law. Dow’s two Litho University℠ video tutorials on EUV are a great place to start learning the fundamentals of EUV technology.

Dow’s Peter Trefonas, Ph.D., to Be Honored with SCI Perkin Medal

June 28, 2016

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Trefonas will be honored with an SCI Perkin Medal, the highest honor given for outstanding work in applied chemistry. He is being recognized for his expertise in chemistries and materials used in photolithography processes and for creating materials that have enabled production of smaller feature sizes in semiconductor manufacturing.