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Showing all articles related to Cu plating

Via Fill’s Role in the Evolution of Portable Electronics

July 21, 2016

Cellphones have evolved considerably in the past 20 years, both in terms of form and function, as the market has exploded globally. Development of cellphone technology has been a major driver for advances in semiconductor packaging and printed circuit board (PCB) design, and via fill plays an important role.

Enabling Advanced PCB HVM with Nickel-Free Copper Plating

June 09, 2016

Advanced PCBs for high-density packaging require copper metal interconnects for both horizontal traces as well as vertical micro-via holes. Cost-effective manufacturing requires that fine-line traces and micro-via holes be formed using the same HVM processes. Learn how nickel-free electroless copper plating chemistry enables fine-pattern plating needed in advanced IC substrates.

2016 Dow Korea Award Winner Recognized for Work on OLED Efficiency

May 03, 2016

2016 Dow Korea Award Winners

The Dow Korea Award program honors outstanding work in electronic materials to support the research activities of science and engineering students in Korea. This year’s winner, Seoul National University Ph.D. candidate Kwon-Hyeon Kim was recognized for his work on OLED efficiency, demonstrating EQEs of 35.6% with horizontally oriented dipole moments.

Meeting the Challenges of Copper Plating for Advanced High Layer Count PCBs

February 02, 2016

Meeting the Challenges of Copper Plating for Advanced High Layer Count PCBs

A wide variety of routers, switches, and storage units power today’s Internet. These devices must evolve, offering higher functionality per unit area and relying on state of the art chipsets. This article explores the challenges of manufacturing to meet emerging PCB requirements using Cu plating for advanced high-layer count PCBs.

Addressing Changing Via Fill Requirements for the New Generation HDI PCBs in Industry-Leading Fine-pitch Applications

August 17, 2015

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Today’s high density interconnect (HDI) printed circuit boards (PCBs) increase the functionality of a circuit board while utilizing less area. This article looks at how to solve the challenge of copper (Cu) via-filling HDI structures that meet requirements for complete via-fill of laser micro-vias while simultaneously plating through holes to enable advanced features in electronic devices.