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Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Showing all articles related to Throwing Power

Enabling Advanced PCB HVM with Nickel-Free Copper Plating

June 09, 2016

Advanced PCBs for high-density packaging require copper metal interconnects for both horizontal traces as well as vertical micro-via holes. Cost-effective manufacturing requires that fine-line traces and micro-via holes be formed using the same HVM processes. Learn how nickel-free electroless copper plating chemistry enables fine-pattern plating needed in advanced IC substrates.

Meeting the Challenges of Copper Plating for Advanced High Layer Count PCBs

February 02, 2016

Meeting the Challenges of Copper Plating for Advanced High Layer Count PCBs

A wide variety of routers, switches, and storage units power today’s Internet. These devices must evolve, offering higher functionality per unit area and relying on state of the art chipsets. This article explores the challenges of manufacturing to meet emerging PCB requirements using Cu plating for advanced high-layer count PCBs.