Dow to Showcase New Metallization Chemistries at ECTC 2017

Dow Electronic Materials is a proud sponsor of IEEE’s Electronic Components and Technology Conference (ECTC) 2017. We will have a strong presence on this year’s show floor, where we will introduce two new products to the industry that expand our metallization portfolio for advanced packaging applications. As always, we will also be available to discuss a broad advanced packaging portfolio covering metallization, dielectrics, packaging resists and assembly materials, including silicones.

We first talked about the concept of using indium in advanced packaging applications at last year’s ECTC, and have now brought this product to market. SOLDERON™ BP IN 1000 Indium extends our production-proven SOLDERON electroplating chemistry platform into emerging, low-temperature applications where tin-silver can’t be used, such as optoelectronics, 3D stacking, flexible substrates, biosensors and even compound semiconductors.

Our second new product is the latest generation of INTERVIA™ copper electroplating chemistry. INTERVIA 9000 Cu targets advanced metallization processes used in advanced wafer-level, 2.5D and 3D-IC packaging technologies. Designed to address a wide process window, it is suitable for fan-out wafer-level packaging, 3D stacking Cu plating applications and conventional wafer-level chip-scale packages.

Sponsored by the Components, Packaging and Manufacturing Technology Society of the IEEE, ECTC brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. The conference gathers key stakeholders of the global microelectronic packaging industry, such as semiconductor companies, foundry and OSAT service providers, equipment manufacturers, material suppliers, research institutions and universities, under one roof. Now in its 67^th year, this year’s event will feature more than 360 technical papers in 36 oral sessions and five interactive presentation sessions.

Taking place May 30 to June 2, the topics for this year’s program cover a wide range of technological developments, including advanced packaging, high-speed wireless and components, heterogeneous integration, interconnections, materials, processing and even optoelectronics. Panels will address hot topics like fan-out panel-level packaging and advanced packaging for automotive applications.

The ECTC Technology Corner Exhibition is open:

Please stop by booth 420 to learn more from our experts about these new technologies and how they enable the next generation of electronic devices.

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Photo courtesy of 3D InCites.